Best Paper Award at EMPC, Pisa, Italy – Computational Mechanics and Reliability Group

At the recently held 22nd EMPC – the European Microelectronics and Packaging Conference – the Computational Mechanics and Reliability Group (CMRG) at the School of Computing and Mathematical Sciences has received the prestigious Best Paper Award for their work entitled “Packaging Challenges and Reliability Performance of Compound Semiconductor Focal Plane Arrays”.

Stoyan Stoyanov – Receiving the Award

EMPC is the established international forum and flagship conference of the International Microelectronics and Packaging Society (IMAPS) and the IEEE Electronics Packaging Society, and is the Europe’s premier conference in the field of microelectronics packaging and interconnection technologies, providing top quality coverage of technological innovation in this field.

Over 250 delegates and 100 extra attendees just for the conference exhibition attended this year’s event held on 16-19 September in Pisa, Italy. Speakers from 24 countries presented 130 technical papers from the conference programme disseminating outputs from their latest research and technological innovations.

Roberto Tizani, General Cahir of the EMPC-2019, and the Conference Technical Chair Prof Nihal Sinnadurai presented the EMPC-2019 Best Paper Award to the leading author, Dr Stoyan Stoyanov, along with an award for free participation in the next EMPC-2021 conference in Gothenburg, Sweden.

The paper by the University of Greenwich team is an output from the collaborative research project THEIA, funded by Innovate UK, between University of Greenwich, Microchip Technologies Inc. and Amethyst Research. The project focus was on the development of advanced packaging capabilities and associated design and modelling toolsets that can enable high quality and high reliability assembly of compound semiconductor infrared detector chips featuring high resolution pixel arrays.

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