{"id":1700,"date":"2019-10-01T12:41:56","date_gmt":"2019-10-01T11:41:56","guid":{"rendered":"https:\/\/blogs.gre.ac.uk\/scholarsinspotlight\/?p=1700"},"modified":"2024-08-29T12:48:34","modified_gmt":"2024-08-29T11:48:34","slug":"best-paper-award-at-empc-pisa-italy-computational-mechanics-and-reliability-group","status":"publish","type":"post","link":"https:\/\/blogs.gre.ac.uk\/scholarsinspotlight\/2019\/10\/01\/best-paper-award-at-empc-pisa-italy-computational-mechanics-and-reliability-group\/","title":{"rendered":"Best Paper Award at EMPC, Pisa, Italy &#8211; Computational Mechanics and Reliability Group"},"content":{"rendered":"\n<p class=\"wp-block-paragraph\"> At the recently held 22<sup>nd<\/sup> EMPC &#8211; the European Microelectronics and Packaging Conference &#8211; the Computational Mechanics and Reliability Group (CMRG) at the School of Computing and Mathematical Sciences has received the prestigious Best Paper Award for their work entitled \u201cPackaging Challenges and Reliability Performance of Compound Semiconductor Focal Plane Arrays\u201d. <\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"346\" src=\"https:\/\/blogs.gre.ac.uk\/scholarsinspotlight\/wp-content\/uploads\/sites\/8\/2019\/10\/award-04-e1569929789623-scaled.jpg.jpg\" alt=\"Four men at a podium, and two are shaking hands\" class=\"wp-image-3348\" srcset=\"https:\/\/blogs.gre.ac.uk\/scholarsinspotlight\/wp-content\/uploads\/sites\/8\/2019\/10\/award-04-e1569929789623-scaled.jpg.jpg 600w, https:\/\/blogs.gre.ac.uk\/scholarsinspotlight\/wp-content\/uploads\/sites\/8\/2019\/10\/award-04-e1569929789623-scaled.jpg-300x173.jpg 300w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><figcaption class=\"wp-element-caption\"><strong><a href=\"https:\/\/www.gre.ac.uk\/people\/rep\/faculty-of-engineering-and-science\/stoyan-stoyanov\">Stoyan Stoyanov <\/a>&#8211; Receiving the Award<\/strong><\/figcaption><\/figure>\n\n\n\n<!--more-->\n\n\n\n<p class=\"wp-block-paragraph\">\n\nEMPC is the established international forum and flagship conference of the International Microelectronics and Packaging Society (IMAPS) and the IEEE Electronics Packaging Society, and is the Europe\u2019s premier conference in the field of microelectronics packaging and interconnection technologies, providing top quality coverage of technological innovation in this field. \n\n<\/p>\n\n\n\n<div class=\"wp-block-media-text alignwide has-media-on-the-right\"><div class=\"wp-block-media-text__content\">\n<p class=\"has-text-align-left wp-block-paragraph\">Over 250 delegates and 100 extra attendees just for the conference\nexhibition attended this year\u2019s event held on 16-19 September in Pisa, Italy.\nSpeakers from 24 countries presented 130 technical papers from the conference\nprogramme disseminating outputs from their latest research and technological\ninnovations.<\/p>\n<\/div><figure class=\"wp-block-media-text__media\"><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"768\" src=\"https:\/\/blogs.gre.ac.uk\/scholarsinspotlight\/wp-content\/uploads\/sites\/8\/2019\/10\/IMG_0222-_-Best-Paper-_-Stoyan-1024x768.jpg\" alt=\"\" class=\"wp-image-1705 size-full\" srcset=\"https:\/\/blogs.gre.ac.uk\/scholarsinspotlight\/wp-content\/uploads\/sites\/8\/2019\/10\/IMG_0222-_-Best-Paper-_-Stoyan-1024x768.jpg 1024w, https:\/\/blogs.gre.ac.uk\/scholarsinspotlight\/wp-content\/uploads\/sites\/8\/2019\/10\/IMG_0222-_-Best-Paper-_-Stoyan-300x225.jpg 300w, https:\/\/blogs.gre.ac.uk\/scholarsinspotlight\/wp-content\/uploads\/sites\/8\/2019\/10\/IMG_0222-_-Best-Paper-_-Stoyan-768x576.jpg 768w, https:\/\/blogs.gre.ac.uk\/scholarsinspotlight\/wp-content\/uploads\/sites\/8\/2019\/10\/IMG_0222-_-Best-Paper-_-Stoyan-1536x1152.jpg 1536w, https:\/\/blogs.gre.ac.uk\/scholarsinspotlight\/wp-content\/uploads\/sites\/8\/2019\/10\/IMG_0222-_-Best-Paper-_-Stoyan-2048x1536.jpg 2048w\" sizes=\"auto, (max-width: 767px) 89vw, (max-width: 1000px) 54vw, (max-width: 1071px) 543px, 580px\" \/><\/figure><\/div>\n\n\n\n<p class=\"wp-block-paragraph\">Roberto Tizani, General Cahir of the EMPC-2019, and the\nConference Technical Chair Prof Nihal Sinnadurai presented the EMPC-2019 Best\nPaper Award to the leading author, Dr Stoyan Stoyanov, along with an award for\nfree participation in the next EMPC-2021 conference in Gothenburg, Sweden. <\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The paper by the University of Greenwich team is an output\nfrom the collaborative research project THEIA, funded by Innovate UK, between\nUniversity of Greenwich, Microchip Technologies Inc. and Amethyst Research. The\nproject focus was on the development of advanced packaging capabilities and\nassociated design and modelling toolsets that can enable high quality and high\nreliability assembly of compound semiconductor infrared detector chips\nfeaturing high resolution pixel arrays.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>At the recently held 22nd EMPC &#8211; the European Microelectronics and Packaging Conference &#8211; the Computational Mechanics and Reliability Group (CMRG) at the School of Computing and Mathematical Sciences has received the prestigious Best Paper Award for their work entitled \u201cPackaging Challenges and Reliability Performance of Compound Semiconductor Focal Plane Arrays\u201d.<\/p>\n","protected":false},"author":26,"featured_media":1702,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_jetpack_newsletter_access":"","_jetpack_dont_email_post_to_subs":false,"_jetpack_newsletter_tier_id":0,"_jetpack_memberships_contains_paywalled_content":false,"_jetpack_memberships_contains_paid_content":false,"footnotes":""},"categories":[2],"tags":[],"class_list":["post-1700","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-awards"],"jetpack_sharing_enabled":true,"jetpack_featured_media_url":"https:\/\/blogs.gre.ac.uk\/scholarsinspotlight\/wp-content\/uploads\/sites\/8\/2019\/10\/empc-2019-feature.gif","_links":{"self":[{"href":"https:\/\/blogs.gre.ac.uk\/scholarsinspotlight\/wp-json\/wp\/v2\/posts\/1700","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.gre.ac.uk\/scholarsinspotlight\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.gre.ac.uk\/scholarsinspotlight\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.gre.ac.uk\/scholarsinspotlight\/wp-json\/wp\/v2\/users\/26"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.gre.ac.uk\/scholarsinspotlight\/wp-json\/wp\/v2\/comments?post=1700"}],"version-history":[{"count":2,"href":"https:\/\/blogs.gre.ac.uk\/scholarsinspotlight\/wp-json\/wp\/v2\/posts\/1700\/revisions"}],"predecessor-version":[{"id":3349,"href":"https:\/\/blogs.gre.ac.uk\/scholarsinspotlight\/wp-json\/wp\/v2\/posts\/1700\/revisions\/3349"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.gre.ac.uk\/scholarsinspotlight\/wp-json\/wp\/v2\/media\/1702"}],"wp:attachment":[{"href":"https:\/\/blogs.gre.ac.uk\/scholarsinspotlight\/wp-json\/wp\/v2\/media?parent=1700"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.gre.ac.uk\/scholarsinspotlight\/wp-json\/wp\/v2\/categories?post=1700"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.gre.ac.uk\/scholarsinspotlight\/wp-json\/wp\/v2\/tags?post=1700"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}